US 12,275,888 B2
Agglomerated boron nitride powder, heat dissipation sheet, and semiconductor device
Masanori Yamazaki, Tokyo (JP); Masaya Sugiyama, Tokyo (JP); Naoyuki Komuro, Tokyo (JP); and Hiromu Watanabe, Tokyo (JP)
Assigned to Mitsubishi Chemical Corporation, Tokyo (JP)
Filed by Mitsubishi Chemical Corporation, Tokyo (JP)
Filed on Aug. 2, 2021, as Appl. No. 17/444,201.
Application 17/444,201 is a continuation of application No. PCT/JP2020/007124, filed on Feb. 21, 2020.
Claims priority of application No. 2019-034518 (JP), filed on Feb. 27, 2019.
Prior Publication US 2021/0363399 A1, Nov. 25, 2021
Int. Cl. C09K 5/14 (2006.01); C01B 21/064 (2006.01); C08J 5/18 (2006.01); C08K 3/38 (2006.01); H01L 23/373 (2006.01)
CPC C09K 5/14 (2013.01) [C01B 21/064 (2013.01); C08J 5/18 (2013.01); C08K 3/38 (2013.01); H01L 23/373 (2013.01); C01P 2004/50 (2013.01); C01P 2004/61 (2013.01); C01P 2006/11 (2013.01); C01P 2006/32 (2013.01); C08J 2363/02 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/003 (2013.01)] 20 Claims
 
1. An agglomerated boron nitride powder, having:
a tap density in a range of from 0.65 to less than 0.8 g/mL; and
an interparticle void volume of 0.5 mL/g or more.