US 12,275,867 B2
Adhesive tape for semiconductor package manufacturing process and method for manufacturing same
Byeong Yeon Choi, Gyeonggi-do (KR); Seung Yol Lee, Gyeonggi-do (KR); Suk Hee Kang, Gyeonggi-do (KR); and Gyung Ju Yoon, Gyeonggi-do (KR)
Assigned to MODU TECH CO., LTD., Gyeonggi-do (KR)
Appl. No. 17/922,873
Filed by MODU TECH CO., LTD., Gyeonggi-do (KR)
PCT Filed May 14, 2021, PCT No. PCT/KR2021/006070
§ 371(c)(1), (2) Date Nov. 2, 2022,
PCT Pub. No. WO2021/246680, PCT Pub. Date Dec. 9, 2021.
Claims priority of application No. 10-2020-0068064 (KR), filed on Jun. 5, 2020.
Prior Publication US 2023/0159800 A1, May 25, 2023
Int. Cl. H01L 21/68 (2006.01); C09J 133/08 (2006.01); C09J 133/12 (2006.01); C09J 183/04 (2006.01); H01L 21/683 (2006.01); H01L 23/552 (2006.01)
CPC C09J 133/08 (2013.01) [C09J 133/12 (2013.01); C09J 183/04 (2013.01); H01L 21/6836 (2013.01); H01L 23/552 (2013.01); C09J 2203/326 (2013.01); C09J 2301/1242 (2020.08); C09J 2301/312 (2020.08); C09J 2301/414 (2020.08); H01L 2221/6834 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An adhesive tape for a semiconductor package manufacturing process, the adhesive tape being attached on a lower surface of a semiconductor package on which a plurality of protrusion electrodes are formed, the adhesive tape comprising:
a first base film;
a first adhesive layer containing an acrylic-based copolymer, the first adhesive layer being stacked on top of the first base film;
a second base film containing a metal material in such a manner as to be deformed and then kept deformed during each process in a manner that corresponds to a topology of the lower surface of the semiconductor package, the second base film being stacked on top of the first adhesive layer; and
a second adhesive layer containing silicon having a spiral network structure, the second adhesive layer being on top of the second base film,
wherein the second adhesive layer contains a trimethylated silica-dimethyl siloxane copolymer.