US 12,275,854 B2
Curable composition, film forming method and article manufacturing method
Yuto Ito, Tokyo (JP); Toshiki Ito, Kanagawa (JP); Isao Kawata, Kanagawa (JP); Fen Wan, Austin, TX (US); Timothy Stachowiak, Austin, TX (US); and Weijun Liu, Cedar Park, TX (US)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Nov. 21, 2022, as Appl. No. 17/991,098.
Prior Publication US 2024/0191088 A1, Jun. 13, 2024
Int. Cl. C09D 11/30 (2014.01); B29C 59/00 (2006.01); B29C 59/02 (2006.01); B41J 3/407 (2006.01); C08F 112/32 (2006.01); C08F 112/34 (2006.01); C09D 11/108 (2014.01); C09D 125/02 (2006.01); B29K 25/00 (2006.01)
CPC C09D 11/30 (2013.01) [B29C 59/005 (2013.01); B29C 59/026 (2013.01); B41J 3/407 (2013.01); C08F 112/32 (2013.01); C08F 112/34 (2013.01); C09D 11/108 (2013.01); C09D 125/02 (2013.01); B29K 2025/00 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A curable composition containing:
a polymerizable compound;
a photopolymerization initiator;
and a solvent,
wherein
the curable composition has viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23° C.,
a content of the solvent with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %,
a boiling point of the solvent at normal pressure is less than 250° C., and
the polymerizable compound contains a compound containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle,
the polymerizable compound contains a plurality of types of polymerizable compounds, and
a vapor pressure of each of the plurality of types of polymerizable compounds at 80° C. is not more than 0.001 mmHg.
 
2. A curable composition containing:
a polymerizable compound;
a photopolymerization initiator;
and a solvent,
wherein
the curable composition has viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23° C.,
a content of the solvent with respect to the whole curable composition is not less than 70 vol % and not more than 85 vol %,
a boiling point of the solvent at normal pressure is less than 250° C., and
the polymerizable compound contains a compound containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.
 
4. A film forming method of forming a film of a curable composition in a space between a mold and a substrate, comprising:
an arranging step of discretely arranging a plurality of droplets of a curable composition on the substrate;
a waiting step of waiting until the plurality of droplets discretely arranged on the substrate combine with their respective adjacent droplets and form a continuous liquid film on the substrate, and a solvent contained in the liquid film volatilizes; and
a contact step of bringing the mold and the liquid film on the substrate into contact with each other after the waiting step,
wherein the curable composition contains:
a polymerizable compound;
a photopolymerization initiator; and
a solvent, and
wherein
the curable composition has viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23° C.,
a content of the solvent with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %,
a boiling point of the solvent at normal pressure is less than 250° C., and
the polymerizable compound contains a compound containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.