US 12,275,839 B2
Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structure
Shigeru Yamatsu, Mie (JP); Yasuhiro Suzuki, Osaka (JP); and Hirohisa Hino, Osaka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 17/299,149
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
PCT Filed Nov. 28, 2019, PCT No. PCT/JP2019/046596
§ 371(c)(1), (2) Date Jun. 2, 2021,
PCT Pub. No. WO2020/116313, PCT Pub. Date Jun. 11, 2020.
Claims priority of application No. 2018-226757 (JP), filed on Dec. 3, 2018.
Prior Publication US 2022/0049085 A1, Feb. 17, 2022
Int. Cl. C08L 63/04 (2006.01); C08G 59/24 (2006.01); C08G 59/50 (2006.01); C08G 59/56 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H05K 3/28 (2006.01)
CPC C08L 63/04 (2013.01) [C08G 59/245 (2013.01); C08G 59/5046 (2013.01); C08G 59/56 (2013.01); C08G 59/621 (2013.01); C08G 59/686 (2013.01); C08L 63/00 (2013.01); H01L 21/563 (2013.01); H01L 23/12 (2013.01); H01L 23/291 (2013.01); H01L 23/293 (2013.01); H01L 23/3157 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H05K 3/28 (2013.01); C08L 2203/206 (2013.01); C08L 2205/02 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/10126 (2013.01); H01L 2224/10156 (2013.01); H01L 2224/11013 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81395 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81862 (2013.01); H01L 2224/81906 (2013.01); H01L 2224/81951 (2013.01); H01L 2924/066 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/18161 (2013.01)] 8 Claims
 
1. A reinforcing resin composition comprising:
an epoxy resin (A);
a phenolic resin (B); and
a benzoxazine compound (C); and
an activator (D),
wherein with respect to a total of the epoxy resin (A), the phenolic resin (B), the benzoxazine compound (C), and the activator (D):
proportion of the epoxy resin (A) is within a range from 20% by weight to 60% by weight;
proportion of the phenolic resin (B) is within a range from 10% by weight to 40% by weight;
proportion of the benzoxazine compound (C) is within a range from 5% by weight to 30% by weight; and
proportion of the activator (D) is within a range from 10% by weight to 40% by weight.