	US 12,275,838 B2
	Sheet molding compound and fiber-reinforced composite material
Akira Ota, Tokyo (JP); Masahiro Ichino, Tokyo (JP); and Takuya Teranishi, Tokyo (JP)
Assigned to Mitsubishi Chemical Corporation, Tokyo (JP)
Filed by Mitsubishi Chemical Corporation, Tokyo (JP)
Filed on Oct. 7, 2022, as Appl. No. 17/938,881.
Application 17/938,881 is a continuation of application No. 16/594,122, filed on Oct. 7, 2019, abandoned.
Application 16/594,122 is a continuation of application No. PCT/JP2018/015027, filed on Apr. 10, 2018.
Claims priority of application No. 2017-079132 (JP), filed on Apr. 12, 2017.
Prior Publication US 2023/0046977 A1, Feb. 16, 2023
Int. Cl. C08L 63/00 (2006.01); C08G 59/28 (2006.01); C08G 59/50 (2006.01); C08J 5/24 (2006.01); C08K 5/1539 (2006.01); C08K 7/06 (2006.01); C08K 5/315 (2006.01)

CPC C08L 63/00 (2013.01) [C08G 59/28 (2013.01); C08G 59/5053 (2013.01); C08J 5/243 (2021.05); C08J 5/249 (2021.05); C08K 5/1539 (2013.01); C08K 7/06 (2013.01); C08J 2363/00 (2013.01); C08K 5/3155 (2013.01)]

18 Claims

1. A process for manufacturing a sheet molding compound, comprising:

impregnating a sheet-like substance formed of chopped reinforcing fiber tows with an epoxy resin composition; and

thickening the epoxy resin composition so that the epoxy resin composition shifts to a B-stage,

wherein the epoxy resin composition comprises

a component (A),

a component (B) and

a component (C),

wherein

the component (A) is an epoxy resin staying in a liquid state at 25° C. and comprises a glycidyl amine-based epoxy resin,

the component (B) is an acid anhydride,

the component (C) is an epoxy resin curing agent comprising an imidazole-based compound having a melting point of 120° C. to 300° C.,

wherein the epoxy resin composition is free of a urea compound,

wherein a glass transition temperature of a cured material obtainable by curing the epoxy resin composition at 140° C. for 10 minutes is 140° C. to 163° C., and

wherein a content of the component (C) with respect to 100 parts by mass of the entire epoxy resin contained in the epoxy resin composition is 2 to 10 parts by mass.