US 12,275,817 B2
Hardener for epoxy resins
Edis Kasemi, Zürich (CH); Andreas Kramer, Zürich (CH); Ursula Stadelmann, Zürich (CH); and Urs Burckhardt, Zürich (CH)
Assigned to SIKA TECHNOLOGY AG, Baar (CH)
Appl. No. 17/272,412
Filed by SIKA TECHNOLOGY AG, Baar (CH)
PCT Filed Sep. 30, 2019, PCT No. PCT/EP2019/076493
§ 371(c)(1), (2) Date Mar. 1, 2021,
PCT Pub. No. WO2020/070083, PCT Pub. Date Apr. 9, 2020.
Claims priority of application No. 18197987 (EP), filed on Oct. 1, 2018.
Prior Publication US 2021/0332181 A1, Oct. 28, 2021
Int. Cl. C08G 59/50 (2006.01); C08K 5/17 (2006.01); C08L 63/00 (2006.01); C08L 79/02 (2006.01); C09D 163/00 (2006.01); C09J 163/00 (2006.01)
CPC C08G 59/502 (2013.01) [C08G 59/5033 (2013.01); C08K 5/17 (2013.01); C08L 63/00 (2013.01); C08L 79/02 (2013.01); C09D 163/00 (2013.01); C09J 163/00 (2013.01); C08L 2205/025 (2013.01)] 13 Claims
 
1. A curing agent for epoxy resins comprising:
at least one amine A1 which is N-benzylethane-1,2-diamine,
and at least one amine A2 which is a polyalkyleneamine or polyethyleneimine, wherein the at least one amine A2 is in an unadducted form,
where the weight ratio between amine A1 and amine A2 is in the range from 20/1 to 2/1.