US 12,275,670 B2
Method for joining transparent substrates
Tadatomo Suga, Tokyo (JP); and Yoshiie Matsumoto, Tokyo (JP)
Assigned to Tadatomo SUGA, Tokyo (JP); and iSABers Japan Co. Ltd., Tokyo (JP)
Appl. No. 17/296,490
Filed by iSABers Japan Co. Ltd., Tokyo (JP); and Tadatomo Suga, Tokyo (JP)
PCT Filed Nov. 25, 2019, PCT No. PCT/JP2019/046041
§ 371(c)(1), (2) Date Dec. 20, 2021,
PCT Pub. No. WO2020/111015, PCT Pub. Date Jun. 4, 2020.
Claims priority of application No. 2018-219838 (JP), filed on Nov. 26, 2018.
Prior Publication US 2022/0332637 A1, Oct. 20, 2022
Int. Cl. C03C 27/04 (2006.01); B32B 17/06 (2006.01); C03C 17/245 (2006.01); C03C 27/10 (2006.01); C23C 14/08 (2006.01); C23C 14/46 (2006.01); C23C 14/58 (2006.01); H10K 71/50 (2023.01)
CPC C03C 27/042 (2013.01) [B32B 17/06 (2013.01); C03C 17/245 (2013.01); C03C 27/10 (2013.01); C23C 14/081 (2013.01); C23C 14/46 (2013.01); C23C 14/5833 (2013.01); H10K 71/50 (2023.02); C03C 2217/214 (2013.01); C03C 2218/154 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method for bonding transparent substrates,
preparing a pair of transparent substrates;
forming a thin film of aluminum oxide by a sputtering method, on a bonding surface of the transparent substrates;
contacting the aluminum oxide thin films in the air to bond the pair of transparent substrates; and
after the pair of transparent substrates are bonded, heating the bonded pair of transparent substrates.