US 12,275,646 B1
Negative thermal expansion material, method for producing the same, and composite material
Junya Fukazawa, Tokyo (JP); Takuma Kato, Tokyo (JP); and Toru Hata, Tokyo (JP)
Assigned to NIPPON CHEMICAL INDUSTRIAL CO., LTD., Tokyo (JP)
Appl. No. 18/840,630
Filed by NIPPON CHEMICAL INDUSTRIAL CO., LTD., Tokyo (JP)
PCT Filed Feb. 22, 2023, PCT No. PCT/JP2023/006528
§ 371(c)(1), (2) Date Aug. 22, 2024,
PCT Pub. No. WO2023/163058, PCT Pub. Date Aug. 31, 2023.
Claims priority of application No. 2022-029283 (JP), filed on Feb. 28, 2022; and application No. 2022-161760 (JP), filed on Oct. 6, 2022.
Int. Cl. C01G 31/00 (2006.01)
CPC C01G 31/006 (2013.01) [C01P 2002/72 (2013.01); C01P 2004/61 (2013.01); C01P 2004/62 (2013.01); C01P 2006/12 (2013.01); C01P 2006/32 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A negative thermal expansion material, comprising a copper vanadium composite oxide dissolving Li atoms at a content of 100 to 9000 ppm by mass and represented by the following general formula (1):
(CuxMy)(VaPb)Ot  (1)
wherein M represents a metallic element with an atomic number of 11 or more other than Cu and V, 1.60≤x≤2.40, 0.00≤y≤0.40, 1.60≤a≤2.40, 0.00≤b≤0.40, 6.20≤t≤7.80, 1.60≤x+y≤2.40, and 1.60≤a+b≤2.40.