| CPC B28D 5/0076 (2013.01) [B28D 5/045 (2013.01)] | 7 Claims |
|
1. A method for solving a bright line scratched during lifting of a large-size silicon wafer, comprising:
tooling preparation:
first selecting, according to the size of a large-size crystal bar to be cut, a hollow plastic board of the corresponding size, through round holes being equidistantly reserved in the hollow plastic board, and then adding line-cutting fluid into a fluid feed device according to the cutting needs, wherein the number of injection ports provided in the feed device is the same as that of the through round holes reserved in the hollow plastic board; the hollow plastic board is bonded to a crystal holder by adhesive, and the large-size crystal bar is bonded to the crystal holder by the hollow plastic board;
crystal bar bonding:
first bonding an upper surface of the large-size crystal bar to be cut with a lower surface of the hollow plastic board, then bonding an upper surface of the hollow plastic board with a lower surface of the crystal holder, and using a wire cutting machine to drive a diamond wire saw to cut and process the large-size crystal bar rod according to the processing needs;
lifting preparation:
when the large-size crystal bar is completely cut through by the diamond wire saw and moved to the position of the through round holes of the hollow plastic board, stopping displacement, then inserting the injection ports of the fluid feed device into the through round holes of the hollow plastic board in a manner of one-to-one correspondence, and injecting the line-cutting fluid into the through round holes of the hollow plastic board through the injection ports by the fluid feed device; and
lifting:
starting a machine to execute the retracting action after the line-cutting fluid is completely injected into the through round holes and attached to the diamond wire saw, and gradually removing the large-size crystal bar from a diamond wire saw mesh so as to complete the lifting work.
|