	US 12,275,090 B2
	Process for protecting a part made of an aluminum-based alloy containing copper
Coralie Chevallier, Moissy-Cramayel (FR); Mathieu Leroy, Moissy-Cramayel (FR); Marie Savoye, Moissy-Cramayel (FR); and Etienne Nemeth, Moissy-Cramayel (FR)
Assigned to SAFRAN ELECTRONICS & DEFENSE, Paris (FR)
Appl. No. 18/255,716
Filed by SAFRAN ELECTRONICS & DEFENSE, Paris (FR)
PCT Filed Dec. 2, 2021, PCT No. PCT/FR2021/052191 § 371(c)(1), (2) Date Jun. 2, 2023, PCT Pub. No. WO2022/117970, PCT Pub. Date Jun. 9, 2022.
Claims priority of application No. 2012619 (FR), filed on Dec. 3, 2020.
Prior Publication US 2024/0017356 A1, Jan. 18, 2024
Int. Cl. C23C 28/00 (2006.01); B23K 26/352 (2014.01); C23C 28/04 (2006.01); C25D 5/48 (2006.01); C25D 11/04 (2006.01); C25D 11/24 (2006.01); C25D 13/02 (2006.01); C25D 13/22 (2006.01); C22C 21/12 (2006.01); C23C 22/56 (2006.01)

CPC B23K 26/352 (2015.10) [C25D 11/24 (2013.01); C25D 13/22 (2013.01); C22C 21/12 (2013.01); C23C 22/56 (2013.01); C23C 2222/10 (2013.01)]

10 Claims

1. A process for protecting a part comprising an aluminum-based alloy having a copper content greater than or equal to 0.5% by mass, the process comprising:

depositing a non-conductive protective layer over the part;

laser pickling by means of a laser beam of an area of the non-conductive protective layer so as to form an unprotected area having a surface roughness Ra less than or equal to 1.8 μm, the laser pickling being carried out with a laser beam coverage rate greater than or equal to 20% and less than or equal to 80%;

degreasing of the non-conductive protective layer and the unprotected area with an alkaline solution;

chemical conversion, with trivalent chromium, of the unprotected area so as to form a conductive protective layer; and

drying of the part.