US 12,275,086 B2
Method and device for processing a workpiece
Manuel Kiefer, Sinsheim (DE); Christoph Bloemker, Stuttgart (DE); Uwe Mienhardt, Korntal-Muenchingen (DE); Jens Ottnad, Karlsruhe (DE); Leonie Felica Tatzel, Korntal (DE); and Korbinian Weiss, Korntal (DE)
Assigned to TRUMPF WERKZEUGMASCHINEN SE + CO. KG, Ditzingen (DE)
Filed by TRUMPF Werkzeugmaschinen GmbH + Co. KG, Ditzingen (DE)
Filed on Apr. 1, 2021, as Appl. No. 17/219,924.
Application 17/219,924 is a continuation of application No. PCT/EP2019/075452, filed on Sep. 23, 2019.
Claims priority of application No. 10 2018 216 873.3 (DE), filed on Oct. 1, 2018.
Prior Publication US 2021/0245298 A1, Aug. 12, 2021
Int. Cl. B23K 26/08 (2014.01); B23K 26/38 (2014.01); G05B 19/18 (2006.01)
CPC B23K 26/0892 (2013.01) [B23K 26/38 (2013.01); G05B 19/182 (2013.01); G05B 2219/45041 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for processing a workpiece with a laser cutting machine, the method comprising:
A) reading out at least one machine parameter, at least one material parameter, and at least one prioritized cut edge quality feature;
B) executing a process parameter algorithm which outputs a process parameter recommendation, the process parameter algorithm having at least one data aggregation routine, and the process parameter algorithm being configured to determine the process parameter recommendation based on a plurality of cut edge quality features and the at least one prioritized cut edge quality feature using the at least one data aggregation routine so that one edge quality feature is emphasized to a disadvantage of other cut edge quality features of the plurality of cut edge quality features; and
C) operating a laser cutting machine to perform laser processing of the workpiece based on the process parameter recommendation.