US 12,274,261 B2
Antimicrobial solid surfaces and treatments and processes for preparing the same
Kenneth Gauthier Trinder, II, Norfolk, VA (US); and Vikram Kanmukhla, Henrico, VA (US)
Assigned to EOS Surfaces, LLC
Filed by EOS Surfaces, LLC, Norfolk, VA (US)
Filed on Dec. 30, 2021, as Appl. No. 17/566,023.
Application 17/566,023 is a continuation of application No. 16/456,133, filed on Jun. 28, 2019, granted, now 11,252,958.
Application 16/456,133 is a continuation of application No. 14/420,518, abandoned, previously published as PCT/US2013/054040, filed on Aug. 8, 2013.
Claims priority of provisional application 61/681,158, filed on Aug. 9, 2012.
Prior Publication US 2022/0225607 A1, Jul. 21, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. A01N 25/10 (2006.01); A01N 59/20 (2006.01)
CPC A01N 25/10 (2013.01) [A01N 59/20 (2013.01)] 11 Claims
 
1. A continuous pour process for the manufacture of a composite structural solid material comprising a thermoset resin and copper oxide particles substantially uniformly dispersed therein the process comprising the steps of:
mixing a filler with copper oxide until well blended to form a filler-copper oxide blend with a ratio of filler to copper oxide in a range of 20:1 to 1:2, wherein the filler comprises particles having a size range from about 12 to about 20 microns to maintain a substantially uniformly dispersed state of the filler-copper oxide blend throughout the continuous pour process;
stepwise, subsequently mixing said filler-copper oxide blend with a thermoset resin and optionally a pigment to form a copper oxide containing blended composition;
stepwise, subsequently mixing a catalyst with said copper oxide containing blended composition to form a polymerizable composite structural material;
distributing said polymerizable composite structural material in a mold; and
providing conditions for polymerization of said polymerizable composite structural material, thereby preparing a composite structural solid material wherein the copper oxide is present at a concentration ranging from 15% to 50% and wherein a portion of said copper oxide particles are surface exposed.