US D1,021,829 S
Semiconductor module
Yoshihisa Tsukamoto, Kyoto (JP); and Akihiro Kimura, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by ROHM CO., LTD., Kyoto (JP)
Filed on Sep. 13, 2021, as Appl. No. 29/807,560.
Claims priority of application No. 2021-005343 D (JP), filed on Mar. 16, 2021; and application No. 2021-005347 D (JP), filed on Mar. 16, 2021.
Term of patent 15 Years
LOC (14) Cl. 13 - 03
U.S. Cl. D13—182
OG exemplary drawing
 
The ornamental design for a semiconductor module, as shown and described.