US 11,957,055 B2
Thermoelectric transducer, thermoelectric module, binder and method for manufacturing thermoelectric transducer
Takeshi Kawabe, Osaka (JP); Yuriko Kaneko, Nara (JP); Tsutomu Kanno, Kyoto (JP); and Hiromasa Tamaki, Osaka (JP)
Assigned to Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed on Oct. 5, 2022, as Appl. No. 17/960,644.
Application 17/960,644 is a continuation of application No. PCT/JP2021/009381, filed on Mar. 9, 2021.
Claims priority of application No. 2020-070679 (JP), filed on Apr. 10, 2020; and application No. 2020-199982 (JP), filed on Dec. 2, 2020.
Prior Publication US 2023/0044945 A1, Feb. 9, 2023
Int. Cl. H10N 10/17 (2023.01); H10N 10/01 (2023.01); H10N 10/851 (2023.01)
CPC H10N 10/17 (2023.02) [H10N 10/01 (2023.02); H10N 10/851 (2023.02)] 7 Claims
OG exemplary drawing
 
1. A thermoelectric conversion element comprising:
a P-type thermoelectric conversion layer;
a first metal layer;
a second metal layer;
a first joining layer joining a first face of the P-type thermoelectric conversion layer and the first metal layer; and
a second joining layer joining a second face of the P-type thermoelectric conversion layer and the second metal layer, wherein:
the P-type thermoelectric conversion layer comprises a thermoelectric conversion material, the thermoelectric conversion material containing Mg and at least one selected from the group consisting of Sb and Bi,
the first metal layer and the second metal layer each comprise Cu or a Cu alloy, and
the first joining layer and the second joining layer each comprise an Al alloy containing 70.0 atm % or less of Mg.