US 11,957,009 B2
Display device having circuit member stably bonded onto display substrate
Byoungyong Kim, Seoul (KR); Jonghyuk Lee, Seoul (KR); and Jeongho Hwang, Cheonan-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Dec. 8, 2020, as Appl. No. 17/115,155.
Application 17/115,155 is a division of application No. 16/244,372, filed on Jan. 10, 2019, granted, now 10,892,313.
Claims priority of application No. 10-2018-0018219 (KR), filed on Feb. 14, 2018.
Prior Publication US 2021/0091167 A1, Mar. 25, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H10K 59/131 (2023.01); H10K 59/123 (2023.01); H10K 59/124 (2023.01)
CPC H10K 59/131 (2023.02) [H10K 59/123 (2023.02); H10K 59/124 (2023.02)] 30 Claims
OG exemplary drawing
 
1. A display device comprising:
a substrate comprising a pad area;
first conductive pads disposed in a matrix form in the pad area in a first direction and in a second direction intersecting the first direction;
protrusions disposed on the first conductive pads;
second conductive pads disposed on the first conductive pads and the protrusions; and
a circuit member comprising a bump electrically connected to the first conductive pads and the second conductive pads;
wherein the second conductive pads comprise:
contact portions in contact with the first conductive pads; and
raised portions extending from the contact portions, wherein the raised portions cover the protrusions, and have a height greater than a height of the contact portions; and
wherein the plurality of second conductive pads comprise an ultrasonic bondable material.