US 11,956,936 B2
Shielded cable, shielded cable with circuit board, and multicore cable
Yuto Kobayashi, Tochigi (JP)
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Filed by SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Filed on Aug. 30, 2022, as Appl. No. 17/823,204.
Claims priority of application No. 2021-143454 (JP), filed on Sep. 2, 2021.
Prior Publication US 2023/0066194 A1, Mar. 2, 2023
Int. Cl. H01B 7/08 (2006.01); H01B 7/00 (2006.01); H01B 7/02 (2006.01); H01B 11/06 (2006.01); H05K 9/00 (2006.01)
CPC H05K 9/0098 (2013.01) [H01B 7/0009 (2013.01); H01B 7/0216 (2013.01); H05K 9/0084 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A shielded cable comprising:
a first insulated wire including a first central conductor, and a first insulating layer provided around the first central conductor;
a second insulated wire including a second central conductor, and a second insulating layer provided around the second central conductor, the second insulated wire being disposed parallel to the first insulated wire;
a third insulating layer provided around the first insulated wire and the second insulated wire;
a shielding layer provided around the third insulating layer;
a drain wire in contact with the shielding layer; and
a fourth insulating layer provided around the shielding layer and the drain wire, wherein
a distance between the first central conductor and the second central conductor is less than or equal to 1.6 times a distance between the first central conductor and the shielding layer, and less than or equal to 1.6 times a distance between the second central conductor and the shielding layer,
the drain wire has a flat shape,
the first insulating layer includes
a first solid layer provided around the first central conductor,
a first foam layer provided around the first solid layer, and
a third solid layer provided around the first foam layer,
the second insulating layer includes
a second solid layer provided around the second central conductor,
a second foam layer provided around the second solid layer, and
a fourth solid layer provided around the second foam layer, and
the shielding layer includes a plating layer formed on an outer peripheral surface of the third insulating layer.