US 11,956,580 B2
Microphone assembly and headlining assembly
Shunji Muraoka, Osaka (JP); Shushin Noda, Osaka (JP); Yoshifumi Yamanaka, Osaka (JP); Kouta Onoyama, Osaka (JP); Daisuke Kitaguchi, Osaka (JP); and Jun Miyajima, Osaka (JP)
Assigned to HOSIDEN CORPORATION, Osaka (JP)
Filed by HOSIDEN CORPORATION, Osaka (JP)
Filed on Mar. 28, 2022, as Appl. No. 17/706,236.
Claims priority of application No. 2021-063334 (JP), filed on Apr. 2, 2021.
Prior Publication US 2022/0321985 A1, Oct. 6, 2022
Int. Cl. H04R 1/04 (2006.01); H04R 1/08 (2006.01)
CPC H04R 1/04 (2013.01) [H04R 1/083 (2013.01); H04R 2499/13 (2013.01)] 1 Claim
OG exemplary drawing
 
1. A headlining assembly comprising a microphone assembly comprising:
a circuit board;
a microphone element connected to the circuit board;
an external connection interface connected to the circuit board;
a lower housing that fixes the circuit board and has a hole formed to expose a part of a back side of the circuit board or a sound receiving part of the microphone element; and
an upper housing that is fixed to the lower housing and is formed to cover a front side of the circuit board, the microphone element, and the external connection interface, and
the headlining assembly further comprising a headlining, wherein the headlining includes:
a substrate having a front side bonded to a back side of the microphone assembly with an adhesive layer; and
a skin covering a back side of the substrate,
wherein neither the substrate nor the skin has holes.