US 11,956,522 B2
Electronic component assembly with thermally conductive structures for image sensors
Stephen Swihart, Walnut Creek, CA (US); Li Lu, Livermore, CA (US); Wade Jameson, Mesa, AZ (US); Evan Thrush, San Anselmo, CA (US); Michael Griffin, El Cerrito, CA (US); and Evelio Perez, Hercules, CA (US)
Assigned to BIO-RAD LABORATORIES, INC., Hercules, CA (US)
Filed by BIO-RAD LABORATORIES, INC., Hercules, CA (US)
Filed on Dec. 9, 2022, as Appl. No. 18/063,946.
Application 18/063,946 is a continuation of application No. 17/108,672, filed on Dec. 1, 2020, granted, now 11,553,116.
Claims priority of provisional application 62/944,611, filed on Dec. 6, 2019.
Prior Publication US 2023/0109519 A1, Apr. 6, 2023
Int. Cl. H04N 5/335 (2011.01); H04N 23/52 (2023.01); H04N 23/55 (2023.01); H05K 7/20 (2006.01)
CPC H04N 23/52 (2023.01) [H04N 23/55 (2023.01); H05K 7/20472 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An electronic component assembly, comprising:
a circuit board comprising at least one thermal pad disposed on a top surface of the circuit board;
an image sensor disposed on the top surface of the circuit board, comprising at least one conductive pad disposed at at least one corner of the image sensor; and
a thermally conductive layer disposed on a bottom surface of the circuit board,
wherein the at least one thermal pad is coupled to the at least one conductive pad of the image sensor,
wherein the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board, and
wherein the thermally conductive layer has a circular or annular shape.