US 11,955,997 B2
Transceiver using active device array and antenna module including the same
Youngmin Kim, Suwon-si (KR); Hongjong Park, Seoul (KR); Daeyoung Yoon, Yongin-si (KR); Sunwoo Lee, Suncheon-si (KR); Youngki Lee, Suwon-si (KR); and Dooseok Choi, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jul. 19, 2021, as Appl. No. 17/379,461.
Application 17/379,461 is a continuation of application No. 16/743,478, filed on Jan. 15, 2020, granted, now 11,095,318.
Claims priority of application No. 10-2019-0089796 (KR), filed on Jul. 24, 2019.
Prior Publication US 2021/0351797 A1, Nov. 11, 2021
Int. Cl. H04B 1/00 (2006.01); H01L 23/498 (2006.01); H01Q 21/00 (2006.01); H05K 1/02 (2006.01)
CPC H04B 1/005 (2013.01) [H01L 23/49822 (2013.01); H01Q 21/0025 (2013.01); H05K 1/0243 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An antenna module comprising:
a multilayer board including an antenna configured to transmit and receive electromagnetic waves through a top surface of the multilayer board;
a radio frequency (RF) chip on a bottom surface of the multilayer board, the RF chip being connected to the antenna and configured to process an RF signal; and
a first active device array on the bottom surface of the multilayer board, the first active device array comprising a plurality of active devices, a first input pin and a first output pin,
wherein the first input pin and the first output pin are respectively connected to electrodes of a first active device of the plurality of active devices, and
the multilayer board comprises:
a first pattern for a first signal to be provided from the RF chip to the first input pin; and
a second pattern for a second signal to be provided from the first output pin to the RF chip.