US 11,955,975 B2
Routing integrated circuit element
Miaobin Gao, New Taipei (TW); and Chia-Chi Hu, New Taipei (TW)
Assigned to LERAIN TECHNOLOGY CO., LTD., New Taipei (TW)
Filed by LeRain Technology Co., Ltd., New Taipei (TW)
Filed on Dec. 17, 2021, as Appl. No. 17/553,981.
Claims priority of provisional application 63/164,782, filed on Mar. 23, 2021.
Claims priority of application No. 110113261 (TW), filed on Apr. 13, 2021.
Prior Publication US 2022/0311427 A1, Sep. 29, 2022
Int. Cl. H03K 5/02 (2006.01); H01L 23/49 (2006.01); H04Q 11/04 (2006.01)
CPC H03K 5/02 (2013.01) [H01L 23/49 (2013.01); H04Q 11/0471 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A routing integrated circuit element, connected between a first electronic module and a second electronic module so as to transmit an electronic signal, the routing integrated circuit element comprising:
a body, having a first side and a second side, the first side being connected to the first electronic module, the second side being connected to the second electronic module and located on a different side from the first side, and the distance between the second side and the second electronic module being shorter than the distance between the second side and the first electronic module;
a first buffer element, disposed in the body, used for transmitting the electronic signal from the first side to the second side; and
a second buffer element, disposed in the body, used for transmitting the electronic signal from the second side to the first side, wherein a transmission direction of the electronic signal transmitted by the first buffer element and a transmission direction of the electronic signal transmitted by the second buffer element are opposite so that the electronic signal can be smoothly transmitted between the first electronic module and the second electronic module.