US 11,955,958 B2
Electronic power switch drive module
Dominik Schläfli, Nyon (CH); and Stephan Trombert, Leschaux (FR)
Assigned to LEM International SA, Plan-les-Ouates (CH)
Appl. No. 16/976,352
Filed by LEM International SA, Meyrin (CH)
PCT Filed Feb. 27, 2019, PCT No. PCT/EP2019/054788
§ 371(c)(1), (2) Date Aug. 27, 2020,
PCT Pub. No. WO2019/166455, PCT Pub. Date Sep. 6, 2019.
Claims priority of application No. 18159316 (EP), filed on Feb. 28, 2018.
Prior Publication US 2021/0006240 A1, Jan. 7, 2021
Int. Cl. H03K 17/082 (2006.01); G01R 15/18 (2006.01); G01R 15/20 (2006.01); H03K 17/90 (2006.01)
CPC H03K 17/0828 (2013.01) [G01R 15/181 (2013.01); G01R 15/202 (2013.01); G01R 15/207 (2013.01); H03K 17/90 (2013.01); H03K 2217/0027 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An electronic power switch drive module for a power semiconductor unit, comprising an electronic power switch drive and a current transducer mounted on one or more circuit boards, the electronic power switch drive comprising a circuit with at least one circuit portion for controlling at least one electronic power switch of a power semiconductor module of said power semiconductor unit, the current transducer configured to be coupled to an output of the power semiconductor module for measuring an output current of the power semiconductor module, said at least one circuit portion connected to an output potential (Vout) of the output current to be measured, wherein the current transducer comprises at least one magnetic field sensor, the current transducer being electrically connected to said at least one circuit portion of the electronic power switch drive at said output potential, said at least one circuit portion comprising a control logic circuit configured for connection to a control board of said power semiconductor module, a measurement output signal of the current transducer being fed into the control logic circuit, and wherein said circuit of the electronic power switch drive comprises a galvanically isolated connection to an interface circuit for data, power or both data and power connection to the power semiconductor module.