US 11,955,769 B2
Optical element mounting package, electronic device, and electronic module
Akihiko Kitagawa, Kyoto (JP); and Takashi Kimura, Kyoto (JP)
Assigned to KYOCERA CORPORATION, Kyoto (JP)
Appl. No. 17/638,994
Filed by KYOCERA Corporation, Kyoto (JP)
PCT Filed Aug. 27, 2020, PCT No. PCT/JP2020/032375
§ 371(c)(1), (2) Date Feb. 28, 2022,
PCT Pub. No. WO2021/039907, PCT Pub. Date Mar. 4, 2021.
Claims priority of application No. 2019-156637 (JP), filed on Aug. 29, 2019.
Prior Publication US 2022/0271496 A1, Aug. 25, 2022
Int. Cl. H01S 5/02 (2006.01); H01S 5/02212 (2021.01); H01S 5/023 (2021.01); H01S 5/0239 (2021.01)
CPC H01S 5/0239 (2021.01) [H01S 5/02212 (2013.01); H01S 5/023 (2021.01)] 19 Claims
OG exemplary drawing
 
1. An optical element mounting package comprising:
a recess;
a mounting portion for an optical element at a bottom surface of the recess; and
a reflector in the recess, the reflector being positioned forward in an emission direction of light of the optical element,
wherein a first portion that is a portion of an inner side surface of the recess and is positioned in an opposite direction to the emission direction has an inclined surface toward the bottom surface of the recess, and
wherein the inclined surface is a convex surface.