US 11,955,732 B2
Wireless communication technology, apparatuses, and methods
Erkan Alpman, Portland, OR (US); Arnaud Lucres Amadjikpe, Beaverton, OR (US); Omer Asaf, Oranit (IL); Kameran Azadet, San Ramon, CA (US); Rotem Banin, Even-Yehuda (IL); Miroslav Baryakh, Petach Tikva (IL); Anat Bazov, Petach-Tikva (IL); Stefano Brenna, Hillsboro, OR (US); Bryan K. Casper, Portland, OR (US); Anandaroop Chakrabarti, Beaverton, OR (US); Gregory Chance, Chandler, AZ (US); Debabani Choudhury, Thousand Oaks, CA (US); Emanuel Cohen, Zichron Yaacov (IL); Claudio Da Silva, Portland, OR (US); Sidharth Dalmia, Fair Oaks, CA (US); Saeid Daneshgar Asl, Portland, OR (US); Kaushik Dasgupta, Hillsboro, OR (US); Kunal Datta, Los Angeles, CA (US); Brandon Davis, Phoenix, AZ (US); Ofir Degani, Haifa (IL); Amr M. Fahim, Portland, OR (US); Amit Freiman, Haifa (IL); Michael Genossar, Modiin (IL); Eran Gerson, Pardes Hana (IL); Eyal Goldberger, Moshav Beherotaim (IL); Eshel Gordon, Aloney Aba (IL); Meir Gordon, Holon (IL); Josef Hagn, Neubiberg (DE); Shinwon Kang, San Francisco, CA (US); Te Yu Kao, San Jose, CA (US); Noam Kogan, Tel-Aviv (IL); Mikko S. Komulainen, Oulu (FI); Igal Yehuda Kushnir, Hod-Hasharon (IL); Saku Lahti, Tampere (FI); Mikko M. Lampinen, Nokia (FI); Naftali Landsberg, Ramat Gan (IL); Wook Bong Lee, San Jose, CA (US); Run Levinger, Tel Aviv (IL); Albert Molina, Alcobendas (ES); Resti Montoya Moreno, Helsinki (FI); Tawfiq Musah, Hillsboro, OR (US); Nathan G. Narevsky, Portland, OR (US); Hosein Nikopour, San Jose, CA (US); Oner Orhan, San Jose, CA (US); Georgios Palaskas, Portland, OR (US); Stefano Pellerano, Beaverton, OR (US); Ron Pongratz, Tel Aviv (IL); Ashoke Ravi, Portland, OR (US); Shmuel Ravid, Haifa (IL); Peter Andrew Sagazio, Portland, OR (US); Eren Sasoglu, Mountain View, CA (US); Lior Shakedd, Kfar Bilu (IL); Gadi Shor, Tel Aviv (IL); Baljit Singh, San Jose, CA (US); Menashe Soffer, Katzir (IL); Ra'anan Sover, Haifa (IL); Shilpa Talwar, Cupertino, CA (US); Nebil Tanzi, Hoffman Estates, IL (US); Moshe Teplitsky, Tel-Aviv (IL); Chintan S. Thakkar, Portland, OR (US); Jayprakash Thakur, Bangalore (IN); Avi Tsarfati, Rishon le Zion (IL); Yossi Tsfati, Rishon le Zion (IL); Marian Verhelst, Portland, OR (US); Nir Weisman, Hod Hasharon (IL); Shuhei Yamada, Hillsboro, OR (US); Ana M. Yepes, Portland, OR (US); and Duncan Kitchin, Beaverton, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 27, 2022, as Appl. No. 18/089,220.
Application 17/734,529 is a division of application No. 16/472,830, granted, now 11,424,539, previously published as PCT/US2017/067739, filed on Dec. 20, 2017.
Application 18/089,220 is a continuation of application No. 17/734,529, filed on May 2, 2022.
Claims priority of provisional application 62/570,680, filed on Oct. 11, 2017.
Claims priority of provisional application 62/527,818, filed on Jun. 30, 2017.
Claims priority of provisional application 62/511,398, filed on May 26, 2017.
Claims priority of provisional application 62/437,385, filed on Dec. 21, 2016.
Prior Publication US 2023/0145401 A1, May 11, 2023
Int. Cl. H01Q 9/04 (2006.01); H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 1/48 (2006.01); H01Q 3/24 (2006.01); H01Q 5/47 (2015.01); H01Q 21/24 (2006.01); H03L 7/14 (2006.01); H04B 1/3827 (2015.01); H04B 7/0456 (2017.01); H04B 7/06 (2006.01); H04B 15/04 (2006.01)
CPC H01Q 9/0414 (2013.01) [H01Q 1/243 (2013.01); H01Q 1/38 (2013.01); H01Q 1/48 (2013.01); H01Q 3/24 (2013.01); H01Q 5/47 (2015.01); H01Q 21/24 (2013.01); H03L 7/145 (2013.01); H04B 1/3827 (2013.01); H04B 7/0482 (2013.01); H04B 7/0639 (2013.01); H04B 15/04 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A transceiver comprising:
a plurality of patch antennas, the plurality of patch antennas disposed on a first surface of a substrate;
a radio frequency integrated circuit (RFIC) coupled to the plurality of patch antennas, the RFIC disposed on a second surface of the substrate and configured to process RF signals received via the plurality of patch antennas; and
a shield, the shield disposed on the second surface and insulating the RFIC from radio frequency interference (RFI) and electromagnetic interference (EMI).