US 11,955,706 B2
Electronic device including connector
Seungwoo Ryu, Seoul (KR); Joohee Lee, Seoul (KR); and Junyoung Jung, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Appl. No. 17/594,495
Filed by LG ELECTRONICS INC., Seoul (KR)
PCT Filed Apr. 25, 2019, PCT No. PCT/KR2019/005009
§ 371(c)(1), (2) Date Oct. 19, 2021,
PCT Pub. No. WO2020/218642, PCT Pub. Date Oct. 29, 2020.
Prior Publication US 2022/0181775 A1, Jun. 9, 2022
Int. Cl. H05K 1/14 (2006.01); H01Q 1/48 (2006.01); H01Q 21/06 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H01Q 1/48 (2013.01) [H01Q 21/06 (2013.01); H05K 1/0225 (2013.01); H05K 1/0251 (2013.01); H05K 1/181 (2013.01); H05K 2201/10189 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a first multilayered printed circuit board (PCB) including a transceiver circuit;
a second multilayered PCB including antennas; and
a connector to connect the first multilayered PCB and the second multilayered PCB through a plurality of terminals,
wherein the first and second multilayered PCBs each includes signal transmission lines vertically connected for signal transmission between different layers thereof,
wherein the first and second multilayered PCBs each includes a plurality of ground patterns adjacent to one another to constitute a ground vertical-connection between different substrates, and
wherein window regions from which metal patterns are removed are formed between the adjacent ground patterns at the same position of different layers of the first and second multilayered PCBs, so as to improve a matching characteristic at the vertically connected signal transmission lines.