US 11,955,688 B2
Heatsink for millimeter wave (mmW) and non-mmW antenna integration
Cheng-Fan Wei, New Taipei (TW); Chao-Kuei Chang, Taipei (TW); and Yi-Hsiang Kung, Taipei (TW)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Sep. 24, 2021, as Appl. No. 17/484,317.
Prior Publication US 2023/0096131 A1, Mar. 30, 2023
Int. Cl. H01Q 5/307 (2015.01); H01Q 1/02 (2006.01); H01Q 3/36 (2006.01); H01Q 7/00 (2006.01); H01Q 9/30 (2006.01)
CPC H01Q 1/02 (2013.01) [H01Q 3/36 (2013.01); H01Q 7/00 (2013.01); H01Q 9/30 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A wireless communication apparatus, comprising:
a millimeter wave (mmW) module comprising:
at least one mmW antenna; and
at least one mmW signal node configured to communicate a data signal in association with the at least one mmW antenna; and
a heatsink comprising a non-mmW antenna and a non-mmW feed point coupled to the non-mmW antenna, the non-mmW feed point configured to provide a signal path to the non-mmW antenna for a non-mmW signal, wherein the heatsink is mechanically coupled to the mmW module.