US 11,955,684 B2
Components for millimeter-wave communication
Diego Correas-Serrano, Tempe, AZ (US); Georgios Dogiamis, Chandler, AZ (US); Henning Braunisch, Phoenix, AZ (US); Neelam Prabhu Gaunkar, Chandler, AZ (US); and Telesphor Kamgaing, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 25, 2020, as Appl. No. 16/911,568.
Prior Publication US 2021/0408653 A1, Dec. 30, 2021
Int. Cl. H01P 3/16 (2006.01); H01P 1/20 (2006.01); H01P 1/208 (2006.01); H01P 5/02 (2006.01); H01P 5/08 (2006.01)
CPC H01P 3/16 (2013.01) [H01P 1/2002 (2013.01); H01P 1/2088 (2013.01); H01P 5/02 (2013.01); H01P 5/087 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A millimeter-wave dielectric waveguide connector, comprising:
a first material;
a second material, at least partially around the first material, wherein the second material has a dielectric constant that is less than a dielectric constant of the first material;
a third material, at least partially around the second material, wherein the third material has a loss tangent that is greater than a loss tangent of the second material;
a first connector interface, wherein a first end of the first material is exposed at the first connector interface; and
a second connector interface, wherein a second end of the first material is exposed at the second connector interface.