US 11,955,587 B2
Light emitting diode package structure and manufacturing method thereof and manufacturing method of display device
Jeng-Ting Li, Pingtung County (TW); Chi-Hai Kuo, Taoyuan (TW); Cheng-Ta Ko, Taipei (TW); and Pu-Ju Lin, Hsinchu (TW)
Assigned to Unimicron Technology Corp., Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on Apr. 12, 2021, as Appl. No. 17/227,391.
Claims priority of application No. 110106107 (TW), filed on Feb. 22, 2021.
Prior Publication US 2022/0271208 A1, Aug. 25, 2022
Int. Cl. H01L 33/62 (2010.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 27/156 (2013.01); H01L 33/005 (2013.01); H01L 2933/0066 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A light emitting diode package structure, comprising:
a glass substrate, having an upper surface and a lower surface opposite to each other;
a plurality of conductive through holes, penetrating the glass substrate and connecting the upper surface and the lower surface;
a plurality of active elements, disposed on the upper surface of the glass substrate and electrically connected to the plurality of conductive through holes;
an insulating layer, disposed on the upper surface of the glass substrate and covering the plurality of active elements;
a plurality of light emitting diodes, disposed on the insulating layer and electrically connected to at least one of the plurality of active elements; and
a plurality of pads, disposed on the lower surface of the glass substrate and electrically connected to the plurality of conductive through holes, wherein a source of the at least one of the plurality of active elements is electrically connected to at least one of the plurality of corresponding pads directly through the corresponding conductive through hole.