US 11,955,579 B2
Methods for manufacturing semiconductor device
Kai Cheng, Miao-Li County (TW); Tsau-Hua Hsieh, Miao-Li County (TW); Fang-Ying Lin, Miao-Li County (TW); Tung-Kai Liu, Miao-Li County (TW); Hui-Chieh Wang, Miao-Li County (TW); Chun-Hsien Lin, Miao-Li County (TW); and Jui-Feng Ko, Miao-Li County (TW)
Assigned to INNOLUX CORPORATION, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Apr. 21, 2022, as Appl. No. 17/725,741.
Application 17/725,741 is a division of application No. 16/858,826, filed on Apr. 27, 2020, granted, now 11,335,827.
Application 16/858,826 is a division of application No. 16/002,156, filed on Jun. 7, 2018, abandoned.
Claims priority of provisional application 62/539,579, filed on Aug. 1, 2017.
Claims priority of application No. 201810178352.4 (CN), filed on Mar. 5, 2018.
Prior Publication US 2022/0246791 A1, Aug. 4, 2022
Int. Cl. H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 33/32 (2010.01)
CPC H01L 33/0093 (2020.05) [H01L 33/0095 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/0075 (2013.01); H01L 33/32 (2013.01); H01L 2933/0066 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A method for manufacturing a semiconductor device, comprising:
forming a plurality of light-emitting elements on a first substrate;
forming a first pattern array on a second substrate, wherein the first pattern array comprises an adhesive layer, the adhesive layer is formed on a first portion of the second substrate and not formed on a second portion of the second substrate;
transferring the plurality of light-emitting elements from the first substrate to the second substrate;
forming the first pattern array on a third substrate;
transferring the plurality of light-emitting elements from the second substrate to the third substrate;
forming a second pattern array on a fourth substrate; and
transferring the plurality of light-emitting elements from the third substrate to the fourth substrate,
wherein the adhesive layer on the first portion is surrounded by a plurality of spacer layers on the third substrate, and the plurality of light-emitting elements are transferred from the first portion of the third substrate rather than the second portion of the third substrate to the fourth substrate,
wherein a pitch between the plurality of light-emitting elements on the first substrate is different than a pitch of the first pattern array.