US 11,955,573 B2
Photovoltaic module and method for manufacturing photovoltaic module
Wusong Tao, Jiaxing (CN); Zhendong Chen, Jiaxing (CN); and Junhui Liu, Jiaxing (CN)
Assigned to JINKO SOLAR (HAINING) CO., LTD., Zhejiang (CN); ZHEJIANG JINKO SOLAR CO., LTD., Zhejiang (CN); and JINKO SOLAR CO., LTD., Jiangxi (CN)
Filed by JINKO SOLAR (HAINING) CO., LTD., Jiaxing (CN); ZHEJIANG JINKO SOLAR CO., LTD., Zhejiang (CN); and JINKO SOLAR CO., LTD., Jiangxi (CN)
Filed on Dec. 13, 2022, as Appl. No. 18/065,608.
Claims priority of application No. 202210072955.2 (CN), filed on Jan. 21, 2022.
Prior Publication US 2023/0238467 A1, Jul. 27, 2023
Int. Cl. H01L 31/048 (2014.01); H01L 31/18 (2006.01)
CPC H01L 31/048 (2013.01) [H01L 31/18 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A photovoltaic module, comprising:
a plurality of cell strings;
a first encapsulating adhesive film and a second encapsulating adhesive film that are stacked, wherein a gap between the first encapsulating adhesive film and the second encapsulating adhesive film accommodates the plurality of cell strings; wherein the photovoltaic module has a central region and a peripheral region surrounding the central region, and the plurality of cell strings are disposed in the central region, wherein the first encapsulating adhesive film has at least one first hole in the peripheral region, the second encapsulating adhesive film has at least one second hole in the peripheral region, and each first hole of the at least one first hole is aligned with a corresponding second hole of the at least one second hole, wherein the at least one first hole and the at least one second hole include one or more through holes; and
at least one filling structure, wherein each filling structure of the at least one filling structure fills a respective first hole and a respective second hole, wherein the at least one filling structure includes a material having a crosslinking curing speed that is faster than a crosslinking curing speed of a material in the first encapsulating adhesive film and is faster than a crosslinking curing speed of a material in the second encapsulating adhesive film.