US 11,955,495 B2
Image sensing module
Shih-Ping Lee, Hsinchu (TW); and Wen-Hsien Chen, Taichung (TW)
Assigned to Powerchip Semiconductor Manufacturing Corporation, Hsinchu (TW)
Filed by Powerchip Semiconductor Manufacturing Corporation, Hsinchu (TW)
Filed on Nov. 21, 2022, as Appl. No. 17/991,788.
Application 17/991,788 is a division of application No. 16/898,412, filed on Jun. 10, 2020, granted, now 11,563,047.
Claims priority of application No. 109113796 (TW), filed on Apr. 24, 2020.
Prior Publication US 2023/0079629 A1, Mar. 16, 2023
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14625 (2013.01) [H01L 27/14629 (2013.01)] 5 Claims
OG exemplary drawing
 
1. An image sensing module, comprising:
an image sensor disposed on a main board, and comprising a plurality of isolation structures and a photoelectric conversion element between the plurality of isolation structures; and
a light guide element disposed on the image sensor,
wherein the light guide element is configured to make a light beam, incident to a light incident surface of the photoelectric conversion element through the light guide element, having an angle with a normal vector of the light incident surface being about equal to the Brewster angle at the interface of the light beam incident to the light incident surface.