US 11,955,439 B2
Semiconductor package with redistribution structure and manufacturing method thereof
Wei-Cheng Wu, Hsinchu (TW); Chien-Chia Chiu, Taoyuan (TW); Cheng-Hsien Hsieh, Kaohsiung (TW); Li-Han Hsu, Hsin-Chu (TW); Meng-Tsan Lee, Hsinchu (TW); and Tsung-Shu Lin, New Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jan. 17, 2023, as Appl. No. 18/155,672.
Application 18/155,672 is a continuation of application No. 17/542,527, filed on Dec. 6, 2021, granted, now 11,581,268.
Application 17/542,527 is a continuation of application No. 16/893,440, filed on Jun. 5, 2020, granted, now 11,195,802, issued on Dec. 7, 2021.
Claims priority of provisional application 62/906,119, filed on Sep. 26, 2019.
Prior Publication US 2023/0154863 A1, May 18, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 21/76 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/488 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/56 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/31 (2013.01); H01L 23/488 (2013.01); H01L 23/5384 (2013.01); H01L 24/14 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package, comprising:
a die laterally wrapped by an encapsulant; and
a redistribution structure disposed on the die and on the encapsulant, wherein the redistribution structure comprises:
routing conductive traces electrically connected with the die; and
a shielding plate electrically insulated from the die;
dummy connectors disposed on the shielding plate and electrically connected to the shielding plate; and
active connectors disposed on the routing conductive traces and electrically connected to the die through the routing conductive traces.