US 11,955,438 B2
Thermally-conductive electromagnetic interference (EMI) absorbers
Karen Bruzda, Cleveland, OH (US); and John David Ryan, Cleveland, OH (US)
Assigned to Laird Technologies, Inc., Chesterfield, MO (US)
Filed by Laird Technologies, Inc., Chesterfield, MO (US)
Filed on Sep. 22, 2021, as Appl. No. 17/481,426.
Claims priority of provisional application 63/242,650, filed on Sep. 10, 2021.
Claims priority of provisional application 63/082,142, filed on Sep. 23, 2020.
Prior Publication US 2022/0093525 A1, Mar. 24, 2022
Int. Cl. H01L 23/552 (2006.01); C08K 3/22 (2006.01); C08K 3/34 (2006.01); C08L 25/08 (2006.01); H05K 9/00 (2006.01)
CPC H01L 23/552 (2013.01) [C08K 3/22 (2013.01); C08K 3/34 (2013.01); C08L 25/08 (2013.01); H05K 9/003 (2013.01); H05K 9/0081 (2013.01); C08K 2003/2227 (2013.01); C08L 2203/20 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A thermally-conductive electromagnetic interference (EMI) absorber comprising a matrix and at least one functional filler in the matrix, wherein:
the thermally-conductive EMI absorber has a thermal conductivity greater than 6 Watts per meter per Kelvin (W/mK); and
the thermally-conductive EMI absorber has an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher; and
wherein:
the thermally-conductive EMI absorber includes at least 90% by weight of the at least one functional filler, and the thermally-conductive EMI absorber includes less than 10% by weight of the matrix; and/or
the thermally-conductive EMI absorber includes at least 80% by volume of the at least one functional filler, and the thermally-conductive EMI absorber includes less than 20% by volume of the matrix.