US 11,955,435 B2
Semiconductor packages
Ki Yong Lee, Icheon-si (KR)
Assigned to SK hynix Inc., Icheon-si (KR)
Filed by SK hynix Inc., Icheon-si (KR)
Filed on Dec. 29, 2021, as Appl. No. 17/564,724.
Claims priority of application No. 10-2021-0106356 (KR), filed on Aug. 11, 2021.
Prior Publication US 2023/0048228 A1, Feb. 16, 2023
Int. Cl. H01L 23/544 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/544 (2013.01) [H01L 23/3128 (2013.01); H01L 25/0657 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54493 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06562 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a semiconductor die;
an encapsulant layer covering the semiconductor die;
a mark formed on a surface of the encapsulant layer; and
a damage barrier layer disposed between the mark and the semiconductor die,
wherein the damage barrier layer includes a reflective layer that reflects laser light.