US 11,955,431 B2
Interposer structures and methods for 2.5D and 3D packaging
Jenny Shio Yin Ong, Bayan Lepas Pulau Pinang (MY); Seok Ling Lim, Kulim Kedah (MY); Bok Eng Cheah, Gelugor Pulau Pinang (MY); Jackson Chung Peng Kong, Tanjung Tokong Pulau Pinang (MY); and Saravanan Sethuraman, Bayan Lepas Pulau Pinang (MY)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Aug. 7, 2020, as Appl. No. 16/987,437.
Claims priority of application No. PI2020002899 (MY), filed on Jun. 5, 2020.
Prior Publication US 2021/0384133 A1, Dec. 9, 2021
Int. Cl. H01L 23/49 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01)
CPC H01L 23/5385 (2013.01) [H01L 21/486 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5381 (2013.01); H01L 23/5386 (2013.01); H01L 23/552 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A device comprising:
an extension platform, the extension platform having at least one opening and a recess-step portion;
an interposer in the opening in the extension platform, wherein the interposer is separated by a space from the extension platform and is at least partially encircled by the extension platform;
at least one bridge coupling the extension platform and the interposer; and
a substrate, wherein the interposer is coupled to the substrate.