US 11,955,420 B2
Structures with deformable conductors
Mark William Ronay, Portland, OR (US); Trevor Antonio Rivera, Portland, OR (US); Michael Adventure Hopkins, Portland, OR (US); Edward Martin Godshalk, Newberg, PA (US); and Charles J. Kinzel, Portland, OR (US)
Assigned to Liquid Wire Inc., Portland, OR (US)
Filed by Liquid Wire Inc., Portland, OR (US)
Filed on Feb. 27, 2023, as Appl. No. 18/114,420.
Application 18/114,420 is a continuation of application No. 17/395,130, filed on Aug. 5, 2021, granted, now 11,594,480.
Application 17/395,130 is a continuation of application No. 16/548,379, filed on Aug. 22, 2019, granted, now 11,088,063.
Claims priority of provisional application 62/721,538, filed on Aug. 22, 2018.
Prior Publication US 2023/0290717 A1, Sep. 14, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 23/3121 (2013.01); H01L 23/4985 (2013.01); H01L 23/49861 (2013.01); H01L 21/4846 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A circuit assembly comprising:
a substrate layer;
a first insulator layer, positioned on the substrate layer, forming a pattern of channels;
conductive gel, positioned within the pattern of channels;
a second insulator layer, positioned on the first insulator layer and encapsulating the conductive gel within the pattern of channels and forming a plurality of contact points electrically coupled to the pattern of channels, the plurality of contact points including the conductive gel; and
an electric component coupled to the second insulator layer and having terminals operatively coupled to the plurality of contact points.