US 11,955,403 B2
Header for semiconductor package and semiconductor package
Yasuyuki Kimura, Nagano (JP); and Takumi Ikeda, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Mar. 19, 2021, as Appl. No. 17/206,275.
Claims priority of application No. 2020-052653 (JP), filed on Mar. 24, 2020.
Prior Publication US 2021/0305478 A1, Sep. 30, 2021
Int. Cl. H01L 23/373 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/38 (2006.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01); H01S 5/0231 (2021.01); H01S 5/02315 (2021.01)
CPC H01L 23/373 (2013.01) [H01L 23/31 (2013.01); H01L 23/367 (2013.01); H01L 23/38 (2013.01); H01L 33/483 (2013.01); H01L 33/641 (2013.01); H01S 5/0231 (2021.01); H01S 5/02315 (2021.01)] 7 Claims
OG exemplary drawing
 
1. A header for a semiconductor package comprising:
an eyelet having an upper surface and a lower surface;
a first metal block molded integrally with the eyelet, protruding at the upper surface of the eyelet, and having a substantially U shape viewed from a normal direction of the upper surface of the eyelet;
a first lead sealed in a first through hole penetrating the eyelet from the upper surface to the lower surface of the eyelet;
a first substrate having a front surface formed with a first signal pattern electrically connected to the first lead and having a back surface that is an opposite side surface of the front surface, the back surface being fixed to a first end surface of the first metal block;
a second lead sealed in a second through hole penetrating the eyelet from the upper surface to the lower surface of the eyelet; and
a second substrate having a front surface formed with a second signal pattern electrically connected to the second lead and having a back surface that is an opposite side surface of the front surface of the second substrate, the back surface of the second substrate being fixed to a second end surface of the first metal block,
wherein a first portion that is a portion of the back surface of the first substrate and a second portion that is a portion of the back surface of the second substrate are exposed from the first metal block, and
wherein a ground pattern is formed on the first portion of the first substrate and a ground pattern is formed on the second portion of the second substrate.