US 11,955,401 B2
Package structure
Shih-Hui Wang, New Taipei (TW); Der-Chyang Yeh, Hsin-Chu (TW); Shih-Peng Tai, Hsinchu County (TW); Tsung-Shu Lin, Hsinchu (TW); and Yi-Chung Huang, Hsin-Chu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 13, 2023, as Appl. No. 18/182,364.
Application 18/182,364 is a continuation of application No. 17/702,817, filed on Mar. 24, 2022, granted, now 11,626,341.
Application 17/702,817 is a continuation of application No. 16/805,869, filed on Mar. 2, 2020, granted, now 11,289,398, issued on Mar. 29, 2022.
Claims priority of provisional application 62/906,739, filed on Sep. 27, 2019.
Prior Publication US 2023/0215774 A1, Jul. 6, 2023
Int. Cl. H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/3675 (2013.01) [H01L 23/13 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/92225 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a semiconductor device; and
an adhesive pattern, surrounding the semiconductor device, wherein an angle θ is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<θ<90° wherein the adhesive pattern has a first opening, wherein the first opening is a discontinuous section of the adhesive pattern and connects an inner portion defined by the adhesive pattern and a peripheral portion outside the adhesive pattern, and the first opening is misaligned with a corner of the semiconductor device closest to the first opening.