US 11,955,393 B2
Structures for bonding elements including conductive interface features
Rajesh Katkar, Milpitas, CA (US); Laura Wills Mirkarimi, Sunol, CA (US); Bongsub Lee, Mountain View, CA (US); Gaius Gillman Fountain, Jr., Youngsville, NC (US); and Cyprian Emeka Uzoh, San Jose, CA (US)
Assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed by ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed on May 7, 2021, as Appl. No. 17/315,170.
Application 17/315,170 is a division of application No. 16/235,585, filed on Dec. 28, 2018, granted, now 11,004,757.
Claims priority of provisional application 62/686,534, filed on Jun. 18, 2018.
Claims priority of provisional application 62/671,377, filed on May 14, 2018.
Prior Publication US 2021/0265227 A1, Aug. 26, 2021
Int. Cl. H01L 23/10 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/10 (2013.01) [H01L 21/76807 (2013.01); H01L 21/76816 (2013.01); H01L 24/08 (2013.01); H01L 2924/01029 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A bonded structure comprising:
a first element comprising a first conductive interface feature and a first nonconductive interface feature; and
a second element comprising a second conductive interface feature and a second nonconductive interface feature, the second element being stacked on the first element along a vertical dimension, the second conductive interface feature bonded to the first conductive interface feature along a bonding interface and the second nonconductive interface feature bonded to the first nonconductive interface feature along the bonding interface,
wherein a first cross-section of the first conductive interface feature taken along a lateral dimension transverse to the vertical dimension of the first conductive interface feature has a first overall thickness along the vertical dimension,
wherein a second cross-section of the first conductive interface feature along the lateral dimension of the first conductive feature has a second overall thickness along the vertical dimension, the first overall thickness different from the second overall thickness, and
wherein the first conductive interface feature has a back side opposite the bonding interface, the nonconductive interface feature disposed over the back side of the first conductive interface feature.