US 11,955,388 B2
Transmission-based temperature measurement of a workpiece in a thermal processing system
Michael Storek, Dornstadt (DE); Rolf Bremensdorfer, Bibertal (DE); Markus Lieberer, Augsburg (DE); and Michael Yang, Palo Alto, CA (US)
Assigned to Beijing E-Town Semiconductor Technology Co., Ltd., Beijing (CN); and Mattson Technology, Inc., Fremont, CA (US)
Filed by Beijing E-Town Semiconductor Technology Co., Ltd., Beijing (CN); and Mattson Technology, Inc., Fremont, CA (US)
Filed on Mar. 17, 2023, as Appl. No. 18/185,970.
Application 18/185,970 is a continuation of application No. 17/183,992, filed on Feb. 24, 2021, granted, now 11,610,824.
Claims priority of provisional application 62/983,064, filed on Feb. 28, 2020.
Prior Publication US 2023/0230887 A1, Jul. 20, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/66 (2006.01); G01J 5/04 (2006.01); H01L 21/67 (2006.01)
CPC H01L 22/12 (2013.01) [G01J 5/042 (2013.01); H01L 21/67115 (2013.01); H01L 22/34 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A thermal processing system for performing thermal processing of a semiconductor workpiece, the thermal processing system comprising:
a workpiece support plate configured to support a workpiece;
one or more heat sources configured to heat the -workpiece;
a window disposed between the workpiece support plate and the one or more heat sources, the window comprising one or more transparent regions that are transparent to at least a portion of electromagnetic radiation within a measurement wavelength range; and
a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece, the temperature measurement system comprising:
at least one infrared emitter configured to emit infrared radiation;
at least one infrared sensor, the at least one infrared sensor configured to measure infrared radiation within the measurement wavelength range and disposed such that at least one of the one or more transparent regions is at least partially within a field of view of the at least one infrared sensor; and
a controller configured to perform operations, the operations comprising:
obtaining, from the at least one infrared sensor, one or more first measurements associated with the workpiece;
determining, based at least in part on the one or more first measurements, a temperature of the workpiece when the temperature of the workpiece is less than about 600° C.