US 11,955,364 B2
Telescoping linear extension robot
Lawrence A. Wise, San Juan Capistrano, CA (US); and Anthony J. Kilaita, Santa Clarita, CA (US)
Assigned to Kimball Electronics Indiana, Inc., Jasper, IN (US)
Filed by Kimball Electronics Indiana, Inc., Jasper, IN (US)
Filed on Jan. 7, 2022, as Appl. No. 17/570,942.
Claims priority of provisional application 63/140,597, filed on Jan. 22, 2021.
Prior Publication US 2022/0238369 A1, Jul. 28, 2022
Int. Cl. H01L 21/687 (2006.01); B25J 11/00 (2006.01); B25J 15/00 (2006.01); B25J 18/02 (2006.01); H01L 21/67 (2006.01); B25J 13/08 (2006.01)
CPC H01L 21/68707 (2013.01) [B25J 11/0095 (2013.01); B25J 15/0004 (2013.01); B25J 18/02 (2013.01); H01L 21/67259 (2013.01); B25J 13/088 (2013.01)] 19 Claims
OG exemplary drawing
 
16. A method of delivering a substrate for use in semiconductor processing using a telescoping linear extension robot, the method comprising:
placing substrate on a substrate base of the telescoping linear extension robot;
extending a first driven platform a first distance via a direct coupling with a first motor;
extending the first driven platform a second distance beyond the first distance by actuating an intermediate platform via an indirect coupling with the first motor; and
extending a second driven platform a third distance beyond the second distance via a direct coupling with a second motor, the second driven platform including the substrate base.