US 11,955,360 B2
Electrostatic chuck and processing apparatus
Takeshi Takabatake, Akashi (JP); Tomohiro Nakasuji, Akashi (JP); Akira Itoh, Akashi (JP); Kentaro Seto, Fukuoka (JP); Yutaka Omoto, Tokyo (JP); Hiroho Kitada, Tokyo (JP); and Kazuumi Tanaka, Tokyo (JP)
Assigned to TOCALO CO., Ltd., Kobe (JP); and HITACHI HIGH-TECH CORPORATION, Tokyo (JP)
Appl. No. 17/642,083
Filed by TOCALO Co., Ltd., Kobe (JP); and HITACHI HIGH-TECH CORPORATION, Tokyo (JP)
PCT Filed Dec. 24, 2020, PCT No. PCT/JP2020/048578
§ 371(c)(1), (2) Date Mar. 10, 2022,
PCT Pub. No. WO2022/137467, PCT Pub. Date Jun. 30, 2022.
Prior Publication US 2023/0154780 A1, May 18, 2023
Int. Cl. H01L 21/683 (2006.01); H01J 37/32 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/6833 (2013.01) [H01J 37/32715 (2013.01); H01L 21/68757 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A Johnsen-Rahbek force type electrostatic chuck comprising:
a metal substrate;
an electrode for electrostatic attraction provided on the metal substrate with an insulating layer interposed between the metal substrate and the electrode for electrostatic attraction; and
a dielectric layer constituting an electrostatic attraction surface in contact with a workpiece,
wherein
the dielectric layer includes a ceramic spray coating and a sealing component with which pores of the ceramic spray coating are filled, and
the sealing component contains a metal organic salt containing a rare earth element.