US 11,955,353 B2
Temperature adjustment device and method for manufacturing temperature adjustment device
Atsushi Kobayashi, Kanagawa (JP); and Hideaki Ohkubo, Kanagawa (JP)
Assigned to KELK Ltd., Kanagawa (JP)
Appl. No. 17/284,228
Filed by KELK Ltd., Kanagawa (JP)
PCT Filed Oct. 30, 2019, PCT No. PCT/JP2019/042606
§ 371(c)(1), (2) Date Apr. 9, 2021,
PCT Pub. No. WO2020/100597, PCT Pub. Date May 22, 2020.
Claims priority of application No. 2018-214948 (JP), filed on Nov. 15, 2018.
Prior Publication US 2021/0358776 A1, Nov. 18, 2021
Int. Cl. G05D 23/00 (2006.01); H01L 21/67 (2006.01); H10N 10/01 (2023.01)
CPC H01L 21/67103 (2013.01) [H01L 21/67051 (2013.01); H10N 10/01 (2023.02)] 6 Claims
OG exemplary drawing
 
1. A temperature adjustment device comprising:
a flow path plate that includes a flow path groove;
a heat transfer plate that faces the flow path groove; and
a thermoelectric module plate that is connected to the heat transfer plate,
wherein a surface roughness of the flow path plate is 0.20 μm or more and 0.25 μm or less.