US 11,955,347 B2
Encapsulation process for double-sided cooled packages
Teng Hock Kuah, Singapore (SG); Yi Lin, Singapore (SG); Ravindra Raghavendra, Singapore (SG); Kar Weng Yan, Singapore (SG); and Angelito Barrozo Perez, Singapore (SG)
Assigned to ASMPT SINGAPORE PTE. LTD., Singapore (SG)
Filed by ASMPT SINGAPORE PTE. LTD., Singapore (SG)
Filed on Dec. 2, 2021, as Appl. No. 17/540,322.
Prior Publication US 2023/0178382 A1, Jun. 8, 2023
Int. Cl. H01L 21/56 (2006.01); H01L 23/433 (2006.01)
CPC H01L 21/565 (2013.01) [H01L 23/4334 (2013.01)] 16 Claims
OG exemplary drawing
 
1. Method for encapsulating one or more electronic devices mounted on a substrate, including at least one cooling plate in contact with the one or more electronic devices, the method comprising the steps of:
placing the substrate between a first mold half and a second mold half, the first and second mold halves defining a molding cavity for molding the one or more electronic devices;
clamping the substrate between the first and second mold halves;
projecting a cavity insert which is movably located in the first mold half into the cavity in order to contact and apply a sealing pressure onto the at least one cooling plate;
introducing a molding compound into the cavity at a first fill pressure; and thereafter packing the molding compound in the cavity by applying a second fill pressure which is higher than the first fill pressure;
wherein the sealing pressure is maintained at values that are higher than the first fill pressure and the second fill pressure while introducing and packing the molding compound respectively.