US 11,955,322 B2
Device for adjusting position of chamber and plasma process chamber including the same for semiconductor manufacturing
Ming Che Chen, Hsinchu (TW); and Wei-Chen Liao, Guosing Township (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Jun. 25, 2021, as Appl. No. 17/358,808.
Prior Publication US 2022/0415630 A1, Dec. 29, 2022
Int. Cl. C23C 16/455 (2006.01); B08B 7/00 (2006.01); C23C 16/44 (2006.01); H01J 37/32 (2006.01)
CPC H01J 37/32862 (2013.01) [B08B 7/0071 (2013.01); C23C 16/4405 (2013.01); C23C 16/45536 (2013.01); H01J 37/32082 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method using a semiconductor processing chamber, wherein the semiconductor processing chamber includes:
a resonator housing positioned on the semiconductor processing chamber, the resonator housing having a radio frequency (RF) coil disposed within the resonator housing,
an RF power source connected to the semiconductor processing chamber for applying RF power to the RF coil, and
a plurality of jigs disposed about the resonator housing and attached to the semiconductor processing chamber via pre-existing holes in the semiconductor processing chamber,
the method comprising:
recording a first position of the resonator housing using the plurality of jigs;
performing one or more operations using or on the semiconductor processing chamber;
recording a second position of the resonator housing after operating the semiconductor processing chamber; and
determining a shift in a position of the resonator housing based on a difference in the first position and the second position.