US 11,955,309 B2
Automatic adjustment method and automatic adjustment device of beam of semiconductor apparatus, and training method of parameter adjustment model
Zheng-Yang Li, Kaohsiung (TW); Chian-Chen Kuo, Tainan (TW); Yi-Cheng Lu, Kaohsiung (TW); and Ji-Fu Kung, Taichung (TW)
Assigned to UNITED MICROELECTRONICS CORP., Hsinchu (TW)
Filed by UNITED MICROELECTRONICS CORP., Hsinchu (TW)
Filed on Jul. 7, 2021, as Appl. No. 17/369,077.
Claims priority of application No. 110119006 (TW), filed on May 26, 2021.
Prior Publication US 2022/0384139 A1, Dec. 1, 2022
Int. Cl. H01L 21/00 (2006.01); H01J 27/18 (2006.01); H01J 37/08 (2006.01); H01J 37/302 (2006.01); H01J 37/305 (2006.01); H01L 21/67 (2006.01)
CPC H01J 37/08 (2013.01) [H01J 27/18 (2013.01); H01J 37/302 (2013.01); H01J 37/3053 (2013.01); H01L 21/67 (2013.01); H01L 21/67069 (2013.01); H01J 2237/083 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An automatic adjustment method of a beam of a semiconductor apparatus, comprises:
generating the beam by the semiconductor apparatus;
obtaining a wave curve of the beam;
segmenting the wave curve into a plurality of sections;
obtaining a slope of each of the sections;
obtaining a plurality of environmental factors of the semiconductor apparatus; and
analyzing at least one parameter adjustment command of the semiconductor apparatus through a parameter adjustment model according to the slopes and the environmental factors.