US 11,955,282 B2
Capacitor component
Ha Young Song, Suwon-si (KR); Jong Hoon Kim, Suwon-si (KR); and Min Gon Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Dec. 17, 2021, as Appl. No. 17/554,184.
Claims priority of application No. 10-2021-0137247 (KR), filed on Oct. 15, 2021.
Prior Publication US 2023/0117761 A1, Apr. 20, 2023
Int. Cl. H01G 4/005 (2006.01); H01G 4/232 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/005 (2013.01) [H01G 4/2325 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A capacitor component comprising:
a body including a dielectric layer and a plurality of internal electrode layers disposed to oppose each other, with the dielectric layer interposed therebetween; and
an external electrode disposed on the body and connected to the plurality of internal electrode layers,
wherein each of the plurality of internal electrode layers has a capacitance formation portion disposed to overlap an adjacent internal electrode layer, and a lead-out portion extending from the capacitance formation portion and connected to the external electrode,
a ratio (H2/H1) of a height difference H2 to a height difference H1 is 0.2 or less, where the height difference H2 is a distance between the capacitance formation portion of a lowermost of the plurality of internal electrode layers and a region of the lead-out portion of the lowermost internal electrode layer contacting the external electrode and the height difference H1 is a distance between the capacitance formation portion of an upper most of the plurality of internal electrode layers and a region of the lead-out portion of the uppermost internal electrode layer contacting the external electrode, and
an average thickness of the dielectric layer is 420 nm or less.