US 11,955,281 B2
Electronic component and board for mounting the same
Jae Hoon Kim, Suwon-si (KR); Chang Hee Lee, Suwon-si (KR); Jea Hoon Lee, Suwon-si (KR); Hye Jin Kim, Suwon-si (KR); and Yeo Ju Cho, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on May 17, 2021, as Appl. No. 17/321,977.
Claims priority of application No. 10-2020-0159048 (KR), filed on Nov. 24, 2020.
Prior Publication US 2022/0165493 A1, May 26, 2022
Int. Cl. H01G 2/06 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01)
CPC H01G 2/06 (2013.01) [H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic component comprising:
a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and
an interposer disposed below the multilayer capacitor and including an interposer body comprising an insulating material, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively,
wherein 0.24T≤t≤0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer between an upper surface and a lower surface of the interposer body in a stacking direction of the multilayer capacitor and the interposer.