US 11,955,275 B2
Method for producing multilayer coil component
Yuya Ishima, Tokyo (JP); Shinichi Kondo, Tokyo (JP); Kosuke Ito, Tokyo (JP); Shingo Hattori, Tokyo (JP); Takashi Suzuki, Tokyo (JP); and Hidenobu Umeda, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Aug. 27, 2020, as Appl. No. 17/004,334.
Claims priority of application No. 2019-156077 (JP), filed on Aug. 28, 2019.
Prior Publication US 2021/0065975 A1, Mar. 4, 2021
Int. Cl. H01F 41/04 (2006.01); H01F 27/28 (2006.01); H01F 41/12 (2006.01)
CPC H01F 41/041 (2013.01) [H01F 27/2804 (2013.01); H01F 41/04 (2013.01); H01F 41/12 (2013.01); H01F 2027/2809 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for producing a multilayer coil component having an embedded conductive coil, the method comprising:
forming, directly on a face of an electrically conducting support substrate that is not a part of the multilayer coil component when the multilayer coil component is finished, a first coil conductor (i) of the conductive coil and (ii) having a longitudinal axis in a first direction parallel to the face, the face having conductivity;
forming a second coil conductor and a third coil conductor of the conductive coil spaced apart from each other in the first direction, each of the second coil conductor and the third coil conductor extending from the first coil conductor in a second direction orthogonal to the face and the first direction;
forming a fourth coil conductor of the conductive coil electrically connected to an end of the second coil conductor opposite to the first coil conductor and extending in a third direction parallel to the face that is different from the first direction; and
removing the first coil conductor, the second coil conductor, the third coil conductor and the fourth coil conductor from the support substrate, wherein
the forming the first, second and the third coil conductors comprise performing steps in order:
forming on the substrate, a first insulator layer with a first penetration portion having a shape corresponding to the first coil conductor;
exposing a part of the substrate through the first insulator layer, and forming, by plating, the first coil conductor in the first penetration portion;
forming a second insulator layer on the first coil conductor with a second penetration portion and a third penetration portion having a shape corresponding to the second and third coil conductors;
exposing a part of the first coil conductor through the second insulator layer, and forming by plating, the second and third coil conductors in the second and the third penetration portions respectively.