| CPC G06V 40/1306 (2022.01) [G06K 19/07354 (2013.01); G06K 19/07747 (2013.01)] | 20 Claims |
|
1. A fingerprint sensor package comprising:
a first substrate comprising a core insulating layer having a first surface and a second surface opposing each other, the first substrate further comprising a through-hole passing through the first surface and the second surface, a first bonding pad disposed on the second surface of the core insulating layer along a circumference of the through-hole, and an external connection pad disposed between an edge of the second surface of the core insulating layer and the first bonding pad;
a second substrate disposed in the through-hole of the core insulating layer and comprising a plurality of first sensing patterns, the plurality of first sensing patterns being spaced apart from each other in a first direction and extending in a second direction intersecting the first direction, a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad;
a conductive wire connecting the first bonding pad and the second bonding pad;
a controller chip disposed on the second substrate; and
a molding layer disposed on the second surface of the core insulating layer, filling the through-hole, covering the second substrate and the first bonding pad, and spaced apart from the external connection pad.
|