US 11,954,552 B2
RFID tag substrate, RFID tag, and RFID system
Takeshi Hasegawa, Kyoto (JP)
Assigned to KYOCERA CORPORATION, Kyoto (JP)
Appl. No. 17/771,041
Filed by KYOCERA Corporation, Kyoto (JP)
PCT Filed Oct. 21, 2020, PCT No. PCT/JP2020/039583
§ 371(c)(1), (2) Date Apr. 22, 2022,
PCT Pub. No. WO2021/085269, PCT Pub. Date May 6, 2021.
Claims priority of application No. 2019-195328 (JP), filed on Oct. 28, 2019.
Prior Publication US 2022/0398389 A1, Dec. 15, 2022
Int. Cl. G06K 7/10 (2006.01); G06K 19/07 (2006.01); H01Q 7/00 (2006.01); H04B 5/00 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01)
CPC G06K 7/10316 (2013.01) [G06K 19/0723 (2013.01); H01Q 7/00 (2013.01); H05K 1/0243 (2013.01); H05K 1/165 (2013.01); H05K 2201/10098 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An RFID tag substrate comprising:
an insulating substrate that has a mounting region in which a semiconductor device is disposed, the mounting region being included in a first surface of the insulating substrate; and
a coil that is positioned at an outer edge portion of the insulating substrate,
wherein the coil includes a plurality of first coil conductors and a plurality of second coil conductors each having a same line width that are wound such that the first coil conductors and the second coil conductors each have the same number of turns and such that a direction in which the first coil conductors are wound and a direction in which the second coil conductors are wound are opposite to each other, and
wherein the first coil conductors and the second coil conductors are alternately arranged in a thickness direction of the insulating substrate and connected in series to one another.